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Ordering Info
In Stock: 0
MOQ: 90
Package Quantity: 90
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*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 90 | - |
Electrical Characteristics
| Additional Feature | DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY |
| Bit Size | 32 |
| Format | FIXED-POINT |
| JESD-30 Code | S-PBGA-B361 |
| JESD-609 Code | e1 |
| Length | 16 |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 361 |
| Operating Temperature-Max | 105 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Equivalence Code | BGA361,19X19,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.2,1.8,3.3 |
| Qualification Status | Not Qualified |
| RAM (words) | 16384 |
| Seated Height-Max | 1.4 |
| Sub Category | Digital Signal Processors |
| Supply Voltage-Max | 1.26 |
| Supply Voltage-Min | 1.14 |
| Supply Voltage-Nom | 1.2 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 16 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |