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Learn more about ECAD Model here.Electrical Characteristics
Address Bus Width | 15 |
Barrel Shifter | NO |
Bit Size | 32 |
Boundary Scan | YES |
External Data Bus Width | 32 |
Format | FLOATING POINT |
Internal Bus Architecture | MULTIPLE |
JESD-30 Code | S-PBGA-B1031 |
JESD-609 Code | e1 |
Length | 25 |
Low Power Mode | YES |
Moisture Sensitivity Level | 4 |
Number of Terminals | 1031 |
Operating Temperature-Max | 105 |
Operating Temperature-Min | -40 |
Package Body Material | PLASTIC/EPOXY |
Package Code | HBGA |
Package Equivalence Code | BGA1031,37X37,25 |
Package Shape | SQUARE |
Package Style | GRID ARRAY, HEAT SINK/SLUG |
Peak Reflow Temperature (Cel) | 245 |
Power Supplies | 1 |
Qualification Status | Not Qualified |
RAM (words) | 16384 |
Seated Height-Max | 3.31 |
Sub Category | Digital Signal Processors |
Supply Voltage-Max | 1.05 |
Supply Voltage-Min | 0.95 |
Supply Voltage-Nom | 1 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form | BALL |
Terminal Pitch | 0.65 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 25 |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, MIXED |