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Ordering Info
In Stock: 0
MOQ: 2500
Package Quantity: 2500
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 2500 | - |
Electrical Characteristics
| Interface IC Type | INTERFACE CIRCUIT |
| JESD-30 Code | R-PBGA-B12 |
| JESD-609 Code | e1 |
| Length | 2.5 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Terminals | 12 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | VFBGA |
| Package Equivalence Code | BGA12,3X4,20 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.2/3.6,1.8/5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 0.61 |
| Sub Category | Other Interface ICs |
| Supply Voltage-Max | 3.6 |
| Supply Voltage-Min | 1.2 |
| Supply Voltage-Nom | 1.4 |
| Supply Voltage1-Max | 5.5 |
| Supply Voltage1-Min | 1.65 |
| Supply Voltage1-Nom | 1.8 |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.5 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 2 |