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Electrical Characteristics
| Interface IC Type | INTERFACE CIRCUIT |
| JESD-30 Code | R-XBGA-B8 |
| JESD-609 Code | e1 |
| Length | 1.9 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Terminals | 8 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | UNSPECIFIED |
| Package Code | VFBGA |
| Package Equivalence Code | BGA8,2X4,20 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.8/3.3,2.5/5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 0.5 |
| Sub Category | Other Interface ICs |
| Supply Voltage-Max | 3.6 |
| Supply Voltage-Min | 1.65 |
| Supply Voltage-Nom | 1.8 |
| Supply Voltage1-Max | 5.5 |
| Supply Voltage1-Min | 2.3 |
| Supply Voltage1-Nom | 2.5 |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.5 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 0.9 |