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Learn more about ECAD Model here.Electrical Characteristics
| JESD-30 Code | R-PBGA-B100 |
| JESD-609 Code | e4 |
| Length | 13.4 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 100 |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | -20 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LGA |
| Package Equivalence Code | LGA100(UNSPEC) |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 2.9/4.8 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2 |
| Sub Category | Other Telecom ICs |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | OTHER |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | BUTT |
| Terminal Pitch | 0.7 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 13.3 |