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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 20 |
Clock Frequency-Max (fCLK) | 20 |
Data Retention Time-Min | 20 |
Endurance | 20000 |
JESD-30 Code | S-PQFP-G44 |
JESD-609 Code | e0 |
Length | 10 |
Memory Density | 2097152 |
Memory IC Type | CONFIGURATION MEMORY |
Memory Width | 8 |
Moisture Sensitivity Level | 3 |
Number of Functions | 1 |
Number of Terminals | 44 |
Number of Words | 262144 |
Number of Words Code | 256K |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Organization | 256KX8 |
Package Body Material | PLASTIC/EPOXY |
Package Code | TQFP |
Package Equivalence Code | TQFP44,.47SQ,32 |
Package Shape | SQUARE |
Package Style | FLATPACK, THIN PROFILE |
Parallel/Serial | PARALLEL/SERIAL |
Peak Reflow Temperature (Cel) | 225 |
Power Supplies | 2.5/3.3,3.3 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.2 |
Standby Current-Max | 0.01 |
Sub Category | Flash Memories |
Supply Current-Max | 0.025 |
Supply Voltage-Max (Vsup) | 3.6 |
Supply Voltage-Min (Vsup) | 3 |
Supply Voltage-Nom (Vsup) | 3.3 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Tin/Lead (Sn85Pb15) |
Terminal Form | GULL WING |
Terminal Pitch | 0.8 |
Terminal Position | QUAD |
Time@Peak Reflow Temperature-Max (s) | 30 |
Type | NOR TYPE |
Width | 10 |