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Learn more about ECAD Model here.Electrical Characteristics
| Clock Frequency-Max | 667 |
| Combinatorial Delay of a CLB-Max | 0.26 |
| JESD-30 Code | S-PBGA-B324 |
| JESD-609 Code | e1 |
| Length | 15 |
| Moisture Sensitivity Level | 3 |
| Number of CLBs | 715 |
| Number of Inputs | 200 |
| Number of Logic Cells | 9152 |
| Number of Outputs | 200 |
| Number of Terminals | 324 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | 0 |
| Organization | 715 CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Equivalence Code | BGA324,18X18,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.2,2.5/3.3 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.5 |
| Sub Category | Field Programmable Gate Arrays |
| Supply Voltage-Max | 1.26 |
| Supply Voltage-Min | 1.14 |
| Supply Voltage-Nom | 1.2 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 15 |