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Learn more about ECAD Model here.Electrical Characteristics
| Construction | Chip |
| Element Power Dissipation | 0.0625 |
| First Element Resistance | 49.9 |
| JESD-609 Code | e3 |
| Mounting Feature | SURFACE MOUNT |
| Network Type | ISOLATED |
| Number of Elements | 1 |
| Number of Functions | 4 |
| Number of Terminals | 8 |
| Operating Temperature-Max | 155 |
| Operating Temperature-Min | -55 |
| Package Height | 0.45 |
| Package Length | 2 |
| Package Shape | RECTANGULAR PACKAGE |
| Package Style | SMT |
| Package Width | 1 |
| Packing Method | TR, PAPER, 7 INCH |
| Rated Temperature | 70 |
| Resistance | 49.9 |
| Resistor Type | ARRAY/NETWORK RESISTOR |
| Size Code | 408 |
| Sub Category | ARRAY/NETWORK RESISTOR |
| Technology | METAL GLAZE/THICK FILM |
| Temperature Coefficient | 200 |
| Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Terminal Shape | WRAPAROUND |
| Tolerance | 1 |
| Working Voltage | 50 |