Manufacturer
NATIONAL SEMICONDUCTOR
NXP
ST MICROELECTRONICS
TEXAS INSTRUMENTS
IHS ObjectID
1126110229
1271164267
1286233764
1288115349
1288115351
1288115353
1290111147
1335342800
1643513589
1662617196
1689728810
1850831889
1945164637
8072930456
8072930458
8072930466
8079175073
8204611635
8254739831
8307625342
JESD-30 Code
R-PBGA-B6
R-PDSO-G28
S-PBGA-B4
S-PQCC-N16
S-PQCC-N20
S-PQCC-N32
S-PQCC-N36
S-PQFP-G48
S-XQCC-N20
S-XQCC-N32
S-XQCC-N36
JESD-609 Code
e1
e3
e4
Length
1.014
1.24
4
5
6
7
8
9.7
Moisture Sensitivity Level
1
2
3
Number of Functions
1
Number of Terminals
16
20
28
32
36
4
48
6
Operating Temperature-Max
85
Operating Temperature-Min
0
-40
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HQCCN
HVQCCN
LFQFP
TSSOP
VFBGA
Package Equivalence Code
LCC16,.16SQ,25
LCC20,.16SQ,20
LCC32,.27SQ,25
LCC36,.25SQ,20
QFP48,.35SQ,20
TSSOP28,.25
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Power Supplies
1.8/3.6
2.5/3.3
2/3.3
3
Qualification Status
Not Qualified
Seated Height-Max
0.675
0.95
1
1.2
1.4
1.6
Sub Category
Other Telecom ICs
Supply Current-Max
0.04
Supply Voltage-Nom
2.7
3
4.5
5
Surface Mount
YES
Technology
CMOS
Telecom IC Type
RF AND BASEBAND CIRCUIT
RF FRONT END CIRCUIT
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Matte Tin (Sn)
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
GULL WING
NO LEAD
Terminal Pitch
0.4
0.5
0.65
1.42
Terminal Position
BOTTOM
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
0.84
1.014
4
4.4
5
6
7
8