Manufacturer
AMD
NATIONAL SEMICONDUCTOR
NXP
ON SEMICONDUCTOR
ST MICROELECTRONICS
Additional Feature
FULL DUPLEX
HALF DUPLEX; FULL DUPLEX
Data Rate
0.3
1.2
4.8
IHS ObjectID
1419149982
1459627917
1643600248
1813589822
1861425904
1861425905
1861425906
1861425907
2127335456
2127335457
JESD-30 Code
R-CDIP-T28
R-PDIP-T20
R-PDSO-G16
R-PDSO-G28
S-PQCC-J28
S-PQFP-G32
S-PQFP-G44
JESD-609 Code
e0
e3
e4
Length
10
11.506
26.075
38.4302
7
9.7
Moisture Sensitivity Level
3
Neg Supply Voltage-Nom
-5
Number of Functions
1
Number of Terminals
16
20
28
32
44
Operating Temperature-Max
70
85
Operating Temperature-Min
0
-40
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
HTSSOP
LQFP
QCCJ
SOP
Package Equivalence Code
DIP20,.3
DIP28,.6
LDCC28,.5SQ
QFP32,.35SQ,32
QFP44,.47SQ,32
SOP16,.4
TSSOP28,.25
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
FLATPACK, LOW PROFILE
IN-LINE
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
245
260
NOT SPECIFIED
Power Supplies
3.3/5
5
-5
5,9
Seated Height-Max
1.2
1.6
4.572
5.08
Supply Current-Max
0.0006
0.068
0.16
Supply Voltage-Nom
3.3
5
Surface Mount
NO
YES
Technology
BCDMOS
CMOS
MOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
J BEND
THROUGH-HOLE
Terminal Pitch
.65
.8
0.8
1.27
2.54
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
40
NOT SPECIFIED
Width
10
11.506
15.24
4.4
7
7.62