Manufacturer
AMD
ANALOG DEVICES
ASIX
CYPRESS
CYPRESS SEMICONDUCTOR
INTEL
MICROCHIP
MURATA
NXP
ST MICROELECTRONICS
TEXAS INSTRUMENTS
Additional Feature
ALSO OPERATES AT 5V SUPPLY
DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY
IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O
SEATED HGT-NOM
Address Bus Width
26
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
59
External Data Bus Width
16
Format
FIXED-POINT
FLOATING POINT
IHS ObjectID
1048167080
105998307
106015415
106015417
107685225
1085720103
108708769
108708799
108708800
108718556
108910218
110389154
1126114678
113111998
113112050
113146179
113148767
113200583
113200584
113366088
113392382
113408801
113452493
113452494
113452503
113452505
113452511
113452512
113452513
113452515
113452516
113452517
113487768
113626231
113633071
114600343
114791968
114803340
1154058420
1205867809
1294445350
1294445351
1294445353
1334022203
1334022204
1334022209
1334022210
1334022211
1334022212
1420911971
1420911977
1447908770
1482079368
1504601207
1574718645
1574718651
1608070079
1612012377
1633134759
1639665796
1673167377
1718634074
1718634078
1718634080
1724687235
1784620678
1814357339
1814357341
1815869735
1829400940
1850886264
1850886267
2043060363
2053362682
4000167638
4000167646
4000175414
4000175471
8076963574
8076963576
8087741991
8087741997
8087742003
8100225741
8100225742
8138496843
8144535566
8166684610
8166684612
8192017502
8195139019
8202486522
8202486523
8202601818
8202601822
8202601825
8207474540
8272708170
8272708177
8286990183
ASX000000000017
ASX000000000036
ASX000000000084
ASX000000000086
ASX000000000118
AX88178+RTL8251
AXM22001-2A-B
AXM22001-2A-C
Information Access Method
SERIAL, FIXED PROTOCOL
Integrated Cache
YES
Interrupt Capability
N
JESD-30 Code
R-PBGA-B20
R-PDIP-T40
R-PDSO-G14
R-PDSO-G16
R-PDSO-G24
R-PDSO-G28
R-PDSO-G32
R-PDSO-G36
R-PDSO-G48
R-PDSO-G8
R-PDSO-N14
R-PQFP-G128
R-XDIP-T40
R-XDMA-N16
S-PBGA-B337
S-PBGA-B338
S-PBGA-B361
S-PBGA-B49
S-PBGA-B515
S-PBGA-B689
S-PBGA-B71
S-PQCC-N16
S-PQCC-N20
S-PQCC-N32
S-PQCC-N40
S-PQFP-G32
S-PQFP-G48
S-PQFP-G80
S-XQCC-N24
S-XQCC-N32
S-XQCC-N40
S-XQCC-N48
S-XQCC-N56
S-XXMA-N32
JESD-609 Code
e0
e1
e2
e3
e4
Length
10.2
10.3
11
12
12.5
13
14
15.4
16
2.03
3.5
31
4
4.9
5
52.26
6
7
8
8.64
9
Low Power Mode
YES
Moisture Sensitivity Level
1
2
3
Number of Terminals
128
14
16
20
24
28
32
337
338
36
361
40
48
49
515
56
689
71
8
80
Operating Temperature-Max
105
125
70
85
90
Operating Temperature-Min
0
-25
-30
-40
-55
Package Body Material
CERAMIC
PLASTIC/EPOXY
UNSPECIFIED
Package Code
BGA
DIP
FBGA
HQCCN
HSSOP
HVQCCN
HVSON
LFBGA
LFQFP
QCCN
QFP
SOP
SSOP
TSSOP
VFBGA
VFLGA
Package Equivalence Code
BGA337,19X19,25
BGA338,19X19,25
BGA361,19X19,32
BGA49,7X7,20
BGA515,28X28,16
BGA689,29X29,40
DIP40,.6
LCC16,.16SQ,25
LCC32,.2SQ,20
LCC40,.24SQ,20
LCC48,.27SQ,20
LCC56,.31SQ,20
QFP128,.67X.93,20
QFP32,.35SQ,32
QFP48,.35SQ,20
QFP80,.7SQ
SOP14,.25
SOP24,.4
SOP32,.4
SOP8,.25
SSOP28,.3
TSSOP16,.25
TSSOP48,.3,20
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER, HEAT SINK/SLUG
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY
GRID ARRAY, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
IN-LINE
MICROELECTRONIC ASSEMBLY
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
250
260
NOT SPECIFIED
Power Supplies
1
1.1,1.8,3.3
1.2,1.8,3.3
1.3,1.8,3.3
1.35,1.8,3.3
1.8
1.8/5,3/5
2.5/5
20
3
3.3
3.3/5
3/3.3
43164
5
Qualification Status
Not Qualified
RAM (words)
16384
8192
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
0.55
0.6
0.9
1
1.1
1.3
1.4
1.6
1.75
1.8
2
2.45
2.46
2.5
2.65
3.4
5.08
Speed
600
800
Sub Category
Bus Controllers
Digital Signal Processors
DSP Peripherals
Graphics Processors
Microprocessors
Other Microprocessor ICs
Other uPs/uCs/Peripheral ICs
Timer or RTC
Supply Current-Max
.6
0.6
100
120
14
20
220
260
315
40
Supply Voltage-Max
1.1
1.26
1.365
1.42
1.89
12
18
21.5
3.4
3.465
3.6
3.8
45
5.25
5.5
6
Supply Voltage-Min
1
1.14
1.235
1.28
1.71
1.8
2
2.3
2.7
3
3.135
4.5
4.75
5.5
6
6.7
8
Supply Voltage-Nom
1
1.05
1.2
1.3
1.35
1.8
13.5
2.7
20
3
3.3
3.6
5
7
8
Surface Mount
NO
YES
Technology
BICMOS
BIPOLAR
CMOS
ECL
MOS
Temperature Grade
AUTOMOTIVE
COMMERCIAL
INDUSTRIAL
MILITARY
OTHER
Terminal Finish
MATTE TIN
Matte Tin (Sn)
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN
TIN COPPER/TIN SILVER
Tin/Lead (Sn/Pb)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BUTT
GULL WING
NO LEAD
THROUGH-HOLE
Terminal Pitch
.5
.65
.8
0.4
0.5
0.65
0.66
0.8
1
1.27
1.5
2.54
Terminal Position
BOTTOM
DUAL
QUAD
UNSPECIFIED
Time@Peak Reflow Temperature-Max (s)
30
40
NOT SPECIFIED
Time-Min
SECONDS
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
MICROPROCESSOR, RISC
Volatile
NO
Width
1.63
11
12
13
13.4
14
15.24
16
2.5
3.9
31
4
4.4
5
5.3
6
6.1
7
7.5
8
9