Manufacturer
AMIC
CYPRESS SEMICONDUCTOR
ST MICROELECTRONICS
TEXAS INSTRUMENTS
Access Time-Max
10
12
120
13
15
20
23
25
30
40
55
8
Additional Feature
BUBBLE BACK 65NS
BUBBLE BACK 95NS
BYPASS XCVR
FALL THRU 60NS; BUBBLE BACK 60NS
RETRANSMIT
Clock Frequency-Max (fCLK)
10
100
15
20
25
28.5
33.3
40
50
66.7
67
7.14
Cycle Time
10
100
140
15
20
25
30
35
40
45.45
50
66.67
IHS ObjectID
1154959331
1400815489
1401439178
1413505657
1413505678
1413506457
1413506564
1422279264
1429533322
1429533343
1429533515
1429610253
1429610532
1429610625
1429610649
1429737621
1429737991
1429738126
1429738180
1429739054
1429739190
1429739214
1429739238
1429739370
1429739496
1429739574
1438656674
1466608341
LMR16-05W12M-WW001
JESD-30 Code
R-GDIP-T16
R-GDIP-T18
R-GDIP-T28
R-PDIP-T28
R-PDSO-G24
R-PDSO-G56
R-PQCC-J32
S-PQCC-J68
S-PQFP-G32
S-PQFP-G64
JESD-609 Code
e0
e4
Length
10
13.97
14
15.4
18.415
19.431
22.606
24.2316
34.67
37.0205
37.085
37.338
7
Memory Density
18432
2304
256
294912
320
36864
4608
512
73728
9216
Memory IC Type
BI-DIRECTIONAL FIFO
OTHER FIFO
Memory Width
1
18
4
5
8
9
Moisture Sensitivity Level
1
3
Number of Functions
1
2
Number of Terminals
16
18
24
28
32
56
64
68
Number of Words
1024
2048
256
32768
4096
512
64
8192
Number of Words Code
1K
256
2K
32K
4K
512
64
8K
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125
70
85
Operating Temperature-Min
0
-40
-55
Organization
1KX9
256X1
256X9
2KX18
2KX9
32KX9
4KX18
4KX9
512X18
512X9
64X4
64X5
64X8
8KX9
Output Characteristics
3-STATE
TOTEM POLE
Output Enable
NO
YES
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
LQFP
QCCJ
SOP
SSOP
TFQFP
TQFP
Package Equivalence Code
DIP16,.3
DIP18,.3
DIP28,.3
DIP28,.6
LDCC32,.5X.6
LDCC68,1.0SQ
QFP32,.35SQ,32
QFP64,.66SQ,32
SOP24,.4
SSOP56,.4
TQFP32,.35SQ,32
TQFP64,.47SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
FLATPACK
FLATPACK, LOW PROFILE
FLATPACK, THIN PROFILE
FLATPACK, THIN PROFILE, FINE PITCH
IN-LINE
SMALL OUTLINE
SMALL OUTLINE, SHRINK PITCH
Parallel/Serial
PARALLEL
SERIAL
Peak Reflow Temperature (Cel)
225
240
260
NOT SPECIFIED
Power Supplies
5
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
1.2
1.6
2.65
2.79
3.55
4.82
5.08
5.715
Standby Current-Max
.005
0.0004
0.0005
0.005
0.01
0.015
0.02
0.025
0.028
0.04
0.09
0.1
0.125
Sub Category
FIFOs
Supply Current-Max
.08
0.035
0.04
0.05
0.075
0.08
0.085
0.09
0.1
0.105
0.13
0.142
0.1536
0.16
0.17
Supply Voltage-Max (Vsup)
5.5
Supply Voltage-Min (Vsup)
4.5
Supply Voltage-Nom (Vsup)
5
Surface Mount
NO
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
J BEND
THROUGH-HOLE
Terminal Pitch
0.5
0.635
0.8
1.27
2.54
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
10
11.43
14
15.24
24.2316
7
7.5
7.62