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BAP50-03,115 | NXP

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NXP BAP50-03,115

SOD323/PINDIODE / 12NC: 934055520115


Ordering Info

In Stock: 0

Package Quantity: 3000

COO: CN

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Quantity Cost
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Electrical Characteristics

Breakdown Voltage-Min 50
Configuration SINGLE
Diode Capacitance-Max 0.55
Diode Capacitance-Nom 0.55
Diode Element Material SILICON
Diode Forward Resistance-Max 5
Diode Res Test Current 0.5
Diode Res Test Frequency 100
Diode Type PIN DIODE
JESD-30 Code R-PDSO-G2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 150
Operating Temperature-Min -65
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max 0.5
Qualification Status Not Qualified
Reverse Test Voltage 1
Sub Category PIN Diodes
Surface Mount YES
Technology POSITIVE-INTRINSIC-NEGATIVE
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40