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BAP51-02,115 | NXP SEMICONDUCTOR

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NXP SEMICONDUCTOR BAP51-02,115

General purpose PIN diode


RoHS Compliant

Ordering Info

In Stock: 0

MOQ: 3000

Package Quantity: 3000

Quantity Cost
3000 -

Electrical Characteristics

Breakdown Voltage-Min 60
Configuration SINGLE
Diode Capacitance-Max .55
Diode Capacitance-Nom .4
Diode Element Material SILICON
Diode Forward Resistance-Max 2.5
Diode Res Test Current .5
Diode Res Test Frequency 100
Diode Type PIN DIODE
JESD-30 Code R-PDSO-F2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 150
Operating Temperature-Min -65
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max .715
Qualification Status Not Qualified
Reverse Test Voltage 0
Sub Category PIN Diodes
Surface Mount YES
Technology POSITIVE-INTRINSIC-NEGATIVE
Terminal Finish Tin (Sn)
Terminal Form FLAT
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40