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BGA7350,115 | NXP

NXP BGA7350,115


RoHS Compliant

Ordering Info

In Stock: 0

MOQ: 1500

Package Quantity: 1500

*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.

Quantity Cost
1500 -

Electrical Characteristics

JESD-30 Code S-PQCC-N32
Length 5
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 32
Operating Temperature-Max 85
Operating Temperature-Min -40
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max 1
Supply Voltage-Nom 5
Surface Mount YES
Telecom IC Type RF AND BASEBAND CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 0.5
Terminal Position QUAD
Width 5