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Learn more about ECAD Model here.Electrical Characteristics
| Address Bus Width | 16 |
| Boundary Scan | YES |
| External Data Bus Width | 64 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B624 |
| JESD-609 Code | e1 |
| Length | 21 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 624 |
| Operating Temperature-Max | 125 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | HBGA |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, HEAT SINK/SLUG |
| Peak Reflow Temperature (Cel) | 260 |
| Seated Height-Max | 2.16 |
| Speed | 1000 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 21 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |