Request Quote
Request Quote
Thank you for your inquiry. We are working on your request and will respond as soon as possible. For immediate inquiries please call 1-866-651-2901
Download the free Library Loader to convert this file for your ECAD Tool.
Learn more about ECAD Model here.Electrical Characteristics
Address Bus Width | 32 |
Bit Size | 32 |
Boundary Scan | YES |
Clock Frequency-Max | 66.67 |
External Data Bus Width | 32 |
Format | FLOATING POINT |
Integrated Cache | YES |
JESD-30 Code | S-PBGA-B740 |
JESD-609 Code | e2 |
Length | 37.5 |
Low Power Mode | YES |
Moisture Sensitivity Level | 3 |
Number of Terminals | 740 |
Package Body Material | PLASTIC/EPOXY |
Package Code | LBGA |
Package Equivalence Code | BGA740,37X37,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 1.8/2.5,3.3 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.69 |
Speed | 400 |
Sub Category | Microprocessors |
Supply Voltage-Max | 1.26 |
Supply Voltage-Min | 1.14 |
Supply Voltage-Nom | 1.2 |
Surface Mount | YES |
Technology | CMOS |
Terminal Finish | TIN COPPER/TIN SILVER |
Terminal Form | BALL |
Terminal Pitch | 1 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 40 |
Width | 37.5 |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |