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Learn more about ECAD Model here.Electrical Characteristics
| Bit Size | 32 |
| Format | FIXED-POINT |
| JESD-30 Code | S-PBGA-B338 |
| JESD-609 Code | e1 |
| Length | 13 |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 338 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Equivalence Code | BGA338,19X19,25 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.35,1.8,3.3 |
| Qualification Status | Not Qualified |
| RAM (words) | 8192 |
| Seated Height-Max | 1.3 |
| Sub Category | Digital Signal Processors |
| Supply Voltage-Max | 1.42 |
| Supply Voltage-Min | 1.28 |
| Supply Voltage-Nom | 1.35 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.65 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 13 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |